Materials Science: Research Guide

The July 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.

The Department of Commerce’s CHIPS Research & Development Office today announced the signing of a definitive agreement with SandboxAQ for a $500 million award...

Researchers and manufacturers rely on the library to identify unknown compounds in food, drugs, cosmetics, the environment, body fluids, forensic evidence and...

NIST also improved how X-rays are used to study the atomic structure of metals in real time during 3D printing, allowing researchers to observe how materials...

The Department of Commerce’s CHIPS Program Office announced the signing of a final award for up to $277 million in federal incentives and a loan agreement for...

The Department of Commerce today announced the signing of 9 letters of intent to provide $2.013 billion in federal incentives under the CHIPS and Science Act.

The May 2026 issue of Electronic Device Failure Analysis includes: Electrical Fault Localization of Interconnect Via Chains; Inspection and Metrology Challenges in Hybrid Bonding; Failure Analysis Roadmap: Die-Level Council Update; and Advanced Fault Isolation of USB2 ESD Failures.

The May 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Aerospace Materials and Testing.

A NIST researcher has unveiled the results of a 10-year quest to measure the constant.

The report includes an overview of work completed on the Champlain Towers South investigation.

The March 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Additive Manufacturing.